What should be paid attention to in the process of etching the hardware nameplate?Then for China professional nameplate manufacturers to bring you to understand.
Reduce side erosion and abrupt edge, improve etching coefficient side erosion produces abrupt edge.Usually the longer the printed board is in the etching solution, the more serious the side erosion is.The side erosion of the aluminum sign seriously affects the precision of the printed wire, and serious side erosion will make it impossible to make fine wire.
When the side etching and abrupt edge decrease, the etching coefficient increases. The etching coefficient indicates the ability to keep the thin wire, so that the etched wire is close to the original size.Electroplating etching resist whether tin – lead alloy, tin, tin – nickel alloy or nickel, excessive edge will cause a short circuit wire.An electrical bridge is formed between two points of a wire because the edge breaks easily.
There are many factors affecting side etching, the following are summarized: Hardware nameplate etching method: soaking and bubbling etching will cause greater side etching, splash and spray etching side etching is small, especially spray etching effect is the best.
The etching rate and etching coefficient are different due to different etching liquefaction components.For example: acid copper chloride etching solution etching coefficient is usually 3, alkaline copper chloride etching solution etching coefficient can reach 4.Recent studies have shown that nitric acid based etching systems can achieve almost no side etching, so that the side walls of the lines etched are nearly vertical.The etching system is still being developed.
Slow etching rate will result in severe side etching.The improvement of etching quality has a great relationship with the acceleration of etching rate.The faster the etching speed, the shorter the time the board stays in the etching solution, the smaller the aluminum plate side erosion, the clear and neat etching.
When pH value of alkaline etching solution is higher, side erosion increases.In order to reduce lateral erosion, the general pH value should be controlled below 8.5.
The low density of the alkaline etching solution will aggravate the side erosion. It is beneficial to choose the etching solution with high copper concentration to reduce the side erosion.Effect of pH value of alkaline etching solution on side etching of hardware nameplates
To achieve minimal side etching of thin wires, it is best to use (ultra-thin) copper foil.And the thinner the line width, the thinner the thickness of the copper foil.Because the thinner the copper foil, the shorter the time in the etching solution, the smaller the amount of side erosion.
The above is the metal nameplate etching process should pay attention to the problem, I hope to help you.We are a professional nameplate supplier from China – Weihua, welcome to consult!